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US Patent 8890314 Package configurations for low EMI circuits

Patent 8890314 was granted and assigned to Transphorm Inc. on November, 2014 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

88903140

Patent Inventor Names

Yifeng Wu0

Date of Patent

November 18, 2014

Patent Application Number

140634380

Date Filed

October 25, 2013

Patent Citations Received

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US Patent 12074150 Module configurations for integrated III-nitride devices

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US Patent 11749656 Module configurations for integrated III-Nitride devices

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US Patent 11973138 N-polar devices including a depleting layer with improved conductivity

Patent Primary Examiner

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Tu-Tu Ho

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