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US Patent 8916981 Epoxy-amine underfill materials for semiconductor packages

Patent 8916981 was granted and assigned to Intel on December, 2014 by the United States Patent and Trademark Office.

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Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

8916981

Patent Inventor Names

Yonghao Xiu0

Yiqun Bai0

Nachiket R. Raravikar0

Nisha Ananthakrishnan0

Date of Patent

December 23, 2014

Patent Application Number

13891475

Date Filed

May 10, 2013

Patent Citations Received

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US Patent 12132002 Bridge interconnection with layered interconnect structures

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US Patent 11694960 Bridge interconnection with layered interconnect structures

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US Patent 11715695 Size and efficiency of dies

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US Patent 11961804 Size and efficiency of dies

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US Patent 12094827 Size and efficiency of dies

Patent Primary Examiner

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Quoc Hoang

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