US Patent 8936072 Thermal distribution systems and methods

Thermal distribution systems and methods are provided. A thermal distribution system can include a first surface having a perimeter and a second surface. At least a portion of the perimeter can be disposed proximate the second surface, forming a void between the first and second surfaces. The first surface can include a plurality of perforations. The second surface can include at least a portion of an electronic enclosure. A fluid mover having a first inlet can be adapted to draw a first inlet fluid from inside the void.