Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chun-Wen Cheng0
Kai-Chih Liang0
Date of Patent
February 10, 2015
0Patent Application Number
135490950
Date Filed
July 13, 2012
0Patent Citations Received
Patent Primary Examiner
Patent abstract
MEMS devices, packaged MEMS devices, and methods of manufacture thereof are disclosed. In one embodiment, a microelectromechanical system (MEMS) device includes a first MEMS functional structure and a second MEMS functional structure. An interior region of the second MEMS functional structure has a pressure that is different than a pressure of an interior region of the first MEMS functional structure.
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