Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
February 10, 2015
Patent Application Number
13647740
Date Filed
October 9, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a semiconductor chip, an inductor applied to the semiconductor chip. The inductor includes at least one winding. A space within the at least one winding is filled with a magnetic material.
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