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US Patent 8967452 Thermal compression bonding of semiconductor chips

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
April 17, 2012
Date of Patent
March 3, 2015
Patent Application Number
13448866
Patent Citations Received
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US Patent 12074135 Semiconductor device and method of controlling warpage during LAB
0
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US Patent 11756851 Compression-loaded printed circuit assembly for solder defect mitigation
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US Patent 11791231 Compression-loaded printed circuit assembly for solder defect mitigation
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US Patent 11961818 Substrates with heat transfer structures for bonding a stack of microelectronic devices, and related assemblies and electronic systems
0
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US Patent 11688718 Semiconductor device and method of controlling warpage during LAB
0
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US Patent 11705425 Thermocompression bond tips and related apparatus and methods
0
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US Patent 11749595 Fabrication process and structure of fine pitch traces for a solid state diffusion bond on flip chip interconnect
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
8967452
Patent Primary Examiner
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Kiley Stoner

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