Patent attributes
A semiconductor module has a metallic base plate; an insulated circuit board fixed on the metallic base plate; a semiconductor element mounted on the insulated circuit board; a resin case to house the semiconductor element, and having an upper surface with an opening; a terminal exposed from the opening of the resin case to an outer portion in a vertical direction; and an insulating holding piece having a triangular or a rectangular cross-section and one surface contacting the terminal. The terminal has a projecting portion disposed inside the resin case to restrict a movement of the terminal in the vertical direction. The resin case has a first recess portion to fit the projecting portion and a second recess portion disposed on the upper surface of the resin case so that the holding piece pushes the projecting portion on the terminal toward the first recess portion for insertion.
