US Patent 9000577 Interlayer communications for 3D integrated circuit stack

Patent 9000577 was granted and assigned to Intel on April, 2015 by the United States Patent and Trademark Office.

Overview Structured Data Issues Contributors Activity

Is a

Patent

Patent attributes

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

90005770

Patent Inventor Names

Andre Schaefer0

Guido Droege0

Niklas Linkewitsch0

Date of Patent

April 7, 2015

Patent Application Number

139765620

Date Filed

September 30, 2011

Patent Citations Received

‌

US Patent 11973057 Through-silicon transmission lines and other structures enabled by same

Patent Primary Examiner

‌

Phuc Dang

Patent abstract

Some embodiments provide capacitive AC coupling inter-layer communications for 3D stacked modules.

Timeline

No Timeline data yet.

Further Resources

Title

Author

Link

Type

Date

No Further Resources data yet.

References

Find more entities like US Patent 9000577 Interlayer communications for 3D integrated circuit stack

Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.

Open Query Tool

Access by API