Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 14, 2015
Patent Application Number
13601265
Date Filed
August 31, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
An apparatus comprises an interlayer dielectric layer formed on a first side of a substrate, a first metallization layer formed over the interlayer dielectric layer, wherein the first metallization layer comprises a first metal line and a dielectric layer formed over the first metallization layer, wherein the dielectric layer comprises a metal structure having a bottom surface coplanar with a top surface of the first metal line.
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