Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
April 21, 2015
Patent Application Number
13451790
Date Filed
April 20, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A MEMS pressure sensor may be manufactured to include a backing substrate having a diaphragm backing portion and a pedestal portion. A diaphragm substrate may be manufactured to include a pedestal portion and a diaphragm that is mounted to the diaphragm backing portion of the backing substrate to form a stress isolated MEMS die. The pedestal portions of the backing and diaphragm substrates form a pedestal of the stress isolated MEMS die. The pedestal is configured for isolating the diaphragm from stresses including packaging and mounting stress imparted on the stress isolated MEMS die.
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