Patent attributes
An electrostatic chuck plate is connected to a base plate, which includes a cooling mechanism, by an adhesive layer. The electrostatic chuck plate includes a substrate setting surface on which a processed substrate is set, an electrostatic electrode capable of attracting the processed substrate, and a resistance heat generation body capable of heating the processed substrate. The electrostatic electrode and the resistance heat generation body are incorporated in the electrostatic chuck plate. An adjustment portion is arranged at a position according to a temperature distribution of the substrate setting surface in at least one of the upper surface of the base plate and a lower surface of the electrostatic chuck plate that faces the upper surface through the adhesive layer. The adjustment portion is filled with a resin having a heat conductivity according to the temperature distribution.
