US Patent 9035435 Magnetically coupled galvanically isolated communication using lead frame

An integrated circuit package includes an encapsulation and a lead frame. A portion of the lead frame is disposed within encapsulation. The lead frame includes a first conductor having a first conductive loop disposed substantially within the encapsulation. The lead frame also includes a second conductor that is galvanically isolated from the first conductor. The second conductor includes a second conductive loop that is substantially disposed within the encapsulation proximate to and magnetically coupled to the first conductive loop to provide a communication link between the first and second conductors.