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US Patent 9048233 Package systems having interposers

Patent 9048233 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2015 by the United States Patent and Trademark Office.

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Patent abstract

A package system includes an integrated circuit disposed over an interposer. The interposer includes a first interconnect structure. A first substrate is disposed over the first interconnect structure. The first substrate includes at least one first through silicon via (TSV) structure therein. A molding compound material is disposed over the first interconnect structure and around the first substrate. The integrated circuit is electrically coupled with the at least one first TSV structure.

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