Patent attributes
An electronic device includes a motherboard, a power module, a hard disk module, a fan module, a heating module and a power-supply wind scooper. The power module is arranged on a front side of the motherboard along a longitudinal direction, and has a power-supply opening. The hard disk module is stacked on the module. The fan module is located on a rear side of the motherboard along a transverse direction, and further provides airflows towards the power-supply opening of the power module. The heating module is arranged on the motherboard, and further located between the fan module and the power module. The power-supply wind scooper shields a part of the power-supply opening, so as to respectively guide parts of the airflow into the power module and the heating module.
