A composite wiring circuit with electrical through connections and method of manufacturing the same. The composite wiring circuit includes a glass with first electrically-conducting through vias. The first electrically-conducting through vias pass from a top surface of the glass layer to a bottom surface of the glass layer. The composite wiring circuit further includes an interposer layer with second electrically-conducting through vias. The second electrically-conducting through vias pass from a top surface of the interposer layer to a bottom surface of the interposer layer. The second electrically-conducting through vias are electrically coupled to the first electrically-conducting through vias.