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US Patent 9064937 Substrate bonding with diffusion barrier structures
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Patent
Date Filed
May 30, 2013
Date of Patent
June 23, 2015
Patent Application Number
13905442
Patent Citations Received
US Patent 12136605 Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics and method for forming the same
0
US Patent 11929347 Mixed exposure for large die
0
US Patent 11955445 Metal pads over TSV
0
US Patent 12125784 Interconnect structures
0
US Patent 11749645 TSV as pad
US Patent 11756880 Interconnect structures
US Patent 11804377 Method for preparing a surface for direct-bonding
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
9064937
Patent Primary Examiner
Khiem D Nguyen
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