US Patent 9082644 Method of manufacturing and testing a chip package
Patent 9082644 was granted and assigned to Infineon Technologies on July, 2015 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
January 18, 2013
Date of Patent
July 14, 2015
Patent Applicant
Patent Application Number
13745550
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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