Patent attributes
A headphone assembly is provided and includes a headband assembly comprising at least one end; an ear-cup assembly pivotably engaged to the headband assembly by an engagement structure positioned proximate to the at least one end of the headband assembly, the ear-cup assembly comprising a cap and a housing, wherein the cap and the housing are connected to form an enclosed space inside the ear-cup assembly; a transducer configured to produce sound and positioned within the enclosed space of the ear-cup assembly; and a damper rim positioned between the ear-cup assembly and the at least one end of the headband assembly, the damper rim covering the engagement structure and being engaged to the ear-cup assembly and the at least one end of the headband assembly.
