Patent attributes
Embodiments of forming a semiconductor device structure are provided. The semiconductor device structure includes a first semiconductor wafer and a second semiconductor wafer bonded via a hybrid bonding structure, and the hybrid bonding structure includes a first conductive material embedded in a first polymer material and a second conductive material embedded in a second polymer material. The first conductive material is bonded to the second conductive material and the first polymer material is bonded to the second polymer material. The semiconductor device also includes at least one through silicon via (TSV) extending from a bottom surface of the first semiconductor wafer to a metallization structure of the first semiconductor wafer. The semiconductor device structure also includes an interconnect structure formed over the bottom surface of the first semiconductor wafer, and the interconnect structure is electrically connected to the metallization structure via the TSV.
