US Patent 9089060 Ball-out for differential signals

Aspects of the disclosure provide a ball grid array (BGA) package. The ball grid array (BGA) package includes an integrated circuit (IC) packaged in the BGA package, first solder ball, a second solder ball and a third solder ball to transmit a first signal, a second signal, and a third signal. The first signal and the second signal are a pair of differential signals. The third solder ball has a substantially equal distance from the first solder ball and the second solder ball, and thus the first solder ball and the second solder ball are in symmetry with regard to the third solder ball.