US Patent 9101890 Support for use in microchannel processing
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Patent abstract
The disclosed technology relates to an apparatus, comprising: at least one microchannel, the microchannel comprising at least one heat transfer wall; a porous thermally conductive support in the microchannel in contact with the heat transfer wall; a catalyst or a sorption medium supported by the porous support; and a heat source and/or heat sink in thermal contact with the heat transfer wall.
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US Patent 09101890 Support for use in microchannel processing US Patent 9101890 Support for use in microchannel processing
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Patent Number
091018900
Patent Number
91018900
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Patent Jurisdiction
Patent Number
091018900
Date of Patent
August 11, 2015
0Patent Application Number
114438510
Date Filed
May 25, 2006
0Official Website
Patent Primary Examiner
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US Patent 09101890 Support for use in microchannel processing
Infobox
Is a
Patent jurisdiction
Patent number
09101890
Date of patent
August 11, 2015
Patent application number
11443851
Date Filed
May 25, 2006
Patent primary examiner
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