Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
August 18, 2015
0Patent Application Number
135365490
Date Filed
June 28, 2012
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Methods and apparatus are disclosed to form a WLP device that comprises a first chip made of a first technology, and a second chip made of a second technology different from the first technology packaged together by a molding material encapsulating the first chip and the second chip. A post passivation interconnect (PPI) line may be formed on the molding material connected to a first contact pad of the first chip by a first connection, and connected to a second contact pad of the second chip by a second connection, wherein the first connection and the second connection may be a Cu ball, a Cu via, a Cu stud, or other kinds of connections.
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