Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Date of Patent
September 8, 2015
0Patent Application Number
139292400
Date Filed
June 27, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of manufacturing an integrated circuit (IC) package is provided. The method includes mounting a fast plurality of contact members on a surface of a package member, and coupling a second plurality of contact members located on a first surface of an interposer substrate to corresponding ones of the first plurality of contact members. The interposer substrate is configured such that a circuit member mounted to a second surface of the interposer substrate is electrically coupled to the first plurality of contact members.
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