US Patent 9130016 Method of manufacturing through-glass vias

A method of forming a through-glass via hole involves providing a glass substrate having first and second substantially planar parallel surfaces; masking the first and second substantially planar parallel surfaces to form a via-patterned portion thereon; and etching the via-patterned portion on the first and second substantially planar parallel surfaces to form a first channel in the first substantially planar parallel surface and a second channel in the second substantially planar parallel surface. The first channel and second channel are substantially orthogonal or non-orthogonal to one another. The first channel and the second channel intersect to form a quadrilateral through-glass via hole having via openings at the first and second substantially planar parallel surfaces. A low cost, low complexity and high reliability method for producing a glass substrate having a plurality of through-glass via holes such that the glass substrate can be used, for example, as an interposer.