Patent 9136230 was granted and assigned to Broadcom (company) on September, 2015 by the United States Patent and Trademark Office.
Embodiments described herein include an integrated circuit (IC) device. For example, the IC device can include a substrate configured to be coupled to a printed circuit board (PCB), an IC die attached to the substrate, and a waveguide launcher formed on the substrate. The waveguide launcher is electrically coupled to the IC die through the substrate.