Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
October 13, 2015
0Patent Application Number
128329080
Date Filed
July 8, 2010
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Soft polishing pads for polishing semiconductor substrates are described. A soft polishing pad includes a molded homogeneous polishing body having a thermoset, closed cell polyurethane material with a hardness approximately in the range of 20 Shore D to 45 Shore D.
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