Is a
Patent attributes
Current Assignee
0
Patent Jurisdiction
Patent Number
Date of Patent
October 27, 2015
0Patent Application Number
138446380
Date Filed
March 15, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
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