Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 3, 2015
0Patent Application Number
145292460
Date Filed
October 31, 2014
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A manufacturing method of a substrate with a bump structure, a copper layer is formed on a semiconductor substrate, and a nickel layer is formed on the copper layer. A bump structure is composed of the copper layer and the nickel layer, wherein the hardness of the bump structure after annealing process depends on the thickness of the nickel layer to meet the user's demand. The hardness of the bump structure meets the user's demand prevents a glass substrate from cracking when the substrate with the bump structure is bonded with the glass substrate.
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