US Patent 9196575 Integrated circuit package with cavity in substrate

Integrated circuit packages with heat dissipation function are disclosed. A disclosed integrated circuit package includes a first die attached on a top surface of a second die. The second die may be coupled to a thermally conductive block. The thermally conductive block may be embedded in a cavity formed in a package substrate. A heat spreading lid may be disposed over the package substrate. The integrated circuit package may be disposed on a printed circuit substrate via solder bumps or balls. The printed circuit substrate may have heat dissipation paths to dissipate heat from the integrated circuit package.