US Patent 9205395 Encapsulation

Disclosed are encapsulating methods and encapsulated products. A payload material may be encapsulated within a wall material. The carrier material and payload material form a combination that is at least substantially solid at room temperature but that is sufficiently fluid at milling temperature to permit milling and subsequent encapsulation. The payload material may be, for instance, a bitter tasting material. In some embodiments, the microcapsules will serve a taste masking function. In other embodiments, the microcapsules may be used where a slow release of the payload material is desired.