Patent attributes
A package for an arcuate planar lightwave circuit (PLC) chip includes a heater plate coupled to a base by a thick and soft support layer. The arcuate PLC is attached to the heater plate by soft adhesive. A hard adhesive is applied to a multi-waveguide end of the arcuate PLC, to additionally strengthen the attachment of the arcuate PLC to the heater plate. The structure allows the mechanical stress due to fiber pull/shock/vibration to be dissipated in the support layer without introducing large wavelength shifts in the arcuate PLC. The support layer also serves as a heat insulator, facilitating uniform heating of the arcuate PLC.