According to one embodiment, there is provided a solid-state imaging device in which vertical signal lines VL1-1, VL1-2, VL2-1, VL2-2, VL3-1, and VL3-2 are respectively arranged between power lines DL1-1, DL1-3, DL2-1, DL2-3, DL3-1, and DL3-3, power lines DL1-2, DL2-2, and DL3-2 are respectively arranged between the vertical signal lines VL1-1, VL1-2, VL2-1, VL2-2, VL3-1, and VL3-2, power lines DL1-1 and DL1-3 are arranged to cross each other in each pixel in the column direction, power lines DL2-1 and DL2-3 are arranged to cross each other in each pixel in the column direction, and power lines DL3-1 and DL3-3 are arranged to cross each other in each pixel in the column direction.