US Patent 9219461 Capacitive blind-mate module interconnection

A blind-mate capacitive coupling interconnection between a main module enclosure one or more sub-module enclosures has coupling surfaces each with a ground portion and an aperture, an inner element provided in the aperture, spaced away from the ground portion. The coupling surfaces may be provided, for example, as traces on a printed circuit board. To accommodate a degree of mis-alignment, one of the inner elements may be provided larger than the other. Capacitive coupling between the coupling surfaces occurs when the coupling surfaces are mated together, retained in position, for example, by a mechanical fixture.