Patent attributes
A method of inspecting a solder joint through which a lead of a semiconductor device is mounted on a printed circuit board is disclosed. The method includes setting an estimated solder joint region at an outside of an end of the lead of the semiconductor device, capturing an image of the estimated solder joint region, calculating a height of solder joint in the estimated solder joint region by using the captured image of the estimated solder joint region, and determining whether the solder joint is defective by comparing the height of the solder joint in the estimated solder joint region with a reference height of a solder joint, which is previously set. According to the method, reliability of inspection is enhanced regardless of environmental noises.
