Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
December 29, 2015
0Patent Application Number
141007490
Date Filed
December 9, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated circuit includes an interposer die having a surface, a first die mechanically and electrically attached to the surface of the interposer die, and a second die only mechanically attached to the surface of the interposer die using a die attach adhesive.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
