Patent attributes
An image capturing module for reducing assembly tilt includes an image sensing unit, a housing frame and an actuator structure. The image sensing unit includes a carrier substrate and an image sensing chip disposed on the carrier substrate and electrically connected to the carrier substrate. The housing frame is disposed on the carrier substrate to surround the image sensing chip and downwardly contacts the image sensing chip. The actuator structure is disposed on the housing frame and above the image sensing chip. The actuator structure includes a lens holder disposed on the housing frame and a lens assembly disposed inside the lens holder and downwardly contacting the housing frame. Whereby, the image sensing chip, the housing frame and the lens assembly are sequentially stacked on top of one another for reducing the assembly tilt of the lens assembly relative to the image sensing chip.
