Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 2, 2016
Patent Application Number
12873226
Date Filed
August 31, 2010
Patent Citations Received
0
0
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Patent Primary Examiner
Patent abstract
A cooling apparatus includes a direct-bonded copper (“DBC”) substrate, the DBC substrate having a plurality of micro-structure tabs formed on a fluid impingement side of the DBC substrate, and a jet head in complementary opposition to the fluid impingement side. The jet head has a first plurality of micro-jets facing the fluid impingement side, each of the first plurality of micro-jets having a nozzle, and a second plurality of micro-jets facing the fluid impingement side so the jet head is configured to deliver a fluid to the plurality of micro-structure tabs through the first and second plurality of micro-jets.
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