Is a
Patent attributes
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Bernd Memmler0
Reinhard Mahnkopf0
Wolfgang Molzer0
Edmund Goetz0
Date of Patent
February 2, 2016
0Patent Application Number
140372130
Date Filed
September 25, 2013
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Via are described for radio frequency antenna connections related to a package. In one example, a package has a package substrate, a die attached to the package substrate, and a conductive via from the package substrate to an external surface of the package to make a radio frequency connection between the antenna and the package substrate.
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