Patent 9257547 was granted and assigned to Transphorm Inc. on February, 2016 by the United States Patent and Trademark Office.
Embodiments of the present disclosure includes a III-N device having a substrate layer, a first III-N material layer on one side of the substrate layer, a second III-N material layer on the first III-N material layer, and a barrier layer disposed on another side of the substrate layer, the barrier layer being less electrically conductive than the substrate layer.