Is a
Patent attributes
Patent Applicant
Patent Jurisdiction
Patent Number
Patent Inventor Names
Chen-Hua Yu0
Jui-Pin Hung0
Shang-Yun Hou0
Wen-Chih Chiou0
Chiung-Han Yeh0
Der-Chyang Yeh0
Date of Patent
February 16, 2016
Patent Application Number
13764197
Date Filed
February 11, 2013
Patent Citations Received
...
Patent Primary Examiner
Patent abstract
A package includes a chip that has a metal-insulator-metal (MIM) capacitor formed in a first polymer layer and a metallic pillar formed on the MIM capacitor. A molding compound surrounds the chip, a second polymer layer is formed on the chip and the molding compound, a third polymer layer is formed on the second polymer layer, an interconnect structure is formed between the second polymer layer and the third polymer layer and electrically coupled to the metallic pillar and the MIM capacitor, and a bump is formed over and electrically coupled to the interconnect structure.
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