Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 23, 2016
Patent Application Number
13746359
Date Filed
January 22, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
Methods are provided for handling a device wafer. For example, a method includes providing a stack structure having a device wafer, a handler wafer, and a bonding structure disposed between the device wafer and handler wafer, and irradiating the bonding structure with long-wavelength infrared energy to ablate the bonding structure.
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