Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 23, 2016
Patent Application Number
13778969
Date Filed
February 27, 2013
Patent Citations Received
Patent Primary Examiner
Patent abstract
A method of forming a bump structure includes forming a metallization layer on a top metal layer by electroless plating process, forming a polymer layer over the metallization layer; forming an opening on the polymer layer to expose the metallization layer, and forming a solder bump over the exposed metallization layer to make electrical contact with the top metal layer.
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