US Patent 9285554 Through-substrate optical coupling to photonics chips
Is a
Date Filed
February 10, 2012
0
Date of Patent
March 15, 2016
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Patent Application Number
13370886
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Patent Citations Received
Patent Inventor Names
Fuad Doany
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Benjamin G. Lee
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Clint L. Schow
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Patent Jurisdiction
Patent Number
Patent Primary Examiner
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