Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Hsien-Wei Chen0
An-Jhih Su0
Date of Patent
March 22, 2016
Patent Application Number
14276784
Date Filed
May 13, 2014
Patent Citations Received
Patent Primary Examiner
Patent abstract
A first package is bonded to a second package with a structural member located between the first package and the second package for structural support. In an embodiment the structural member is a plate or one or more conductive balls. Once the structural member is in place, the first package is bonded to the second package.
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