Patent attributes
A light emitting diode is provided. The light emitting diode comprises a lead frame, a resin base, an emitting chip and a glue. The lead frame has a plurality of electrode portions thereon. The resin base is provided on the lead frame, the resin base having an outer wall thereon and around an edge to form an opening, and the opening exposing the electrode portions; and an inner wall extending from the outer wall, and the inner side of the inner wall has a slope to decrease the inner diameter of the opening gradually. The emitting chip is attached on the top surface(s) of one or two the electrode portion(s). The glue is filled into a space between the emitting chip and the inner wall to expose the top surface of the emitting chip. Therefore, the illumination of the light emitting diode can be enhanced.