Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Mustafa Incebacak0
Taylan Eker0
Galip Kecelioglu0
Date of Patent
March 29, 2016
0Patent Application Number
143823370
Date Filed
January 25, 2013
0Patent Primary Examiner
Patent abstract
The present invention is related to a microwave component packaging technique which ensures that there is no space between component and pocket after inserting the component into pocket. The continuity of ground connections at the microwave gates of the components is provided just compressing the component without using electrically conductive epoxy material.
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