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US Patent 9302410 Method for cutting object to be processed
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Patent
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Date Filed
July 21, 2010
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Date of Patent
April 5, 2016
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Patent Application Number
13383487
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Patent Citations Received
US Patent 12070875 Silicon carbide wafers with relaxed positive bow and related methods
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US Patent 11911842 Laser-assisted method for parting crystalline material
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Patent Inventor Names
Daisuke Kawaguchi
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Hideki Shimoi
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Naoki Uchiyama
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
9302410
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Patent Primary Examiner
Daniel McNally
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