Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Keng Hung Lin0
Richard K. Williams0
Date of Patent
April 5, 2016
0Patent Application Number
132107640
Date Filed
August 16, 2011
0Patent Citations Received
Patent Primary Examiner
Patent abstract
In a bump-on-leadframe semiconductor package a metal bump formed on a integrated circuit die is used to facilitate the transfer of heat generated in a semiconductor substrate to a metal heat slug and then to an external mounting surface. A structure including arrays of thermal vias may be used to transfer the heat from the semiconductor substrate to the metal bump.
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