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US Patent 9306254 Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration

Patent 9306254 was granted and assigned to Nuvotronics on April, 2016 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Patent Applicant

Current Assignee

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

93062540

Patent Inventor Names

Ken Vanhille0

Will Stacy0

David Sherrer0

Ian Hovey0

J. Robert Reid0

Date of Patent

April 5, 2016

Patent Application Number

142114070

Date Filed

March 14, 2014

Patent Citations Received

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US Patent 11858665 Deployment mechanism with integral actuation device

Patent Primary Examiner

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Benny Lee

Patent abstract

Substrate-free mechanical structural systems comprised of interconnected subsystems of electronic and/or electromechanical components are provided.

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