US Patent 9308381 Ceramic encapsulation of an implantable device

An implantable device is provided. The implantable device may include a flexible carrier configured for implantation in a subject, at least one pair of modulation electrodes associated with the carrier, an antenna configured to receive an electrical signal disposed on the flexible carrier, a circuit electrically coupling the antenna to the at least one pair of modulation electrodes; and a ceramic housing. At least one of the antenna and the circuit may be located within the ceramic housing.